TOKYO – Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January.
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
Greenliant has recently announced the release of its NVMe NANDrive BGA SSDs, a new line of solid-state drives designed to endure the harshest environments while delivering exceptional performance.
Ironwood Electronics announced the release of its high performance socket that allows 0.65mm pitch, 14x17mm body, 20X25 array 500 ball BGA package to be placed in socket and operated without ...
The new Giga-snaP line of BGA SMT adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles and will not warp as plastic ...
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