Dublin, Nov. 12, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Polymeric Materials for Advanced Electronic Packaging 2026-2036" report has been added to ResearchAndMarkets.com's offering. The ...

According to projections from Towards Packaging, the global advanced packaging market is set to increase from USD 43.04 ...

In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the ...

In today’s fast-paced world, high-value electronics—such as smartphones, laptops, gaming consoles, and medical devices—are an essential part of daily life and business operations. These items are not ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level fan-out packaging ...

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

LONDON--(BUSINESS WIRE)--The global fan-out wafer level packaging (FOWLP) market is expected to post a CAGR of almost 16% during the period 2019-2023, according to the latest market research report by ...

Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco ...

As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...