Despite the Commodore 64 having been out of production for probably longer than many Hackaday readers have been alive, its ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
Apple has bought IC Mask Design, a firm specializing in the layout of chips and processors. Apple is continuously acquiring companies, and most recently appears to have been buying ones concerned with ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Anthropic’s CEO voiced concerns Monday about the Trump administration’s approach to export restrictions on advanced AI chips, advocating for stricter controls as the company makes its presence known ...
[Stay on top of transportation news: Get TTNews in your inbox.] TAIPEI, Taiwan — China launched two probes targeting the U.S. semiconductor sector Sept. 13 ahead of talks between the two nations in ...
TAIPEI, Taiwan — China launched two probes targeting the U.S. semiconductor sector Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of ...
China launched two probes targeting the U.S. semiconductor sector Saturday ahead of talks between the two nations in Spain this week on trade, national security and the ownership of social media ...
Qualcomm is reportedly developing a new Snapdragon wearables chip (SW6100), aiming to significantly boost Wear OS smartwatch performance. This next-gen silicon promises improved efficiency and ...
Hosted on MSN
The Poker Chip Holder Trickshot Challenge!
Trump’s shutdown win just landed Republicans with a huge political headache Deer attacks 70-year-old woman in yard, sending her to hospital, NC officials say Airport transport vehicle slams into dock ...
A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Hosted on MSN
I Tested Viral Beer & Chip Holder
I got my hands on the viral beer & chip holder to see if it’s the ultimate game-day gadget—or just a goofy gimmick. With one hand for snacks and the other for a cold drink, it promises peak ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results